CY-DS-100 is a low-speed diamond cutting machine, which equips with the advanced digital micrometer and digital speed display controller, it is the perfect tool for cutting/dicing/slicing all kinds of materials up to 32.5 mm thickness, especially for brittle crystals, ceramics, TEM samples, and even plastic samples.
CY-DS-100 is a low-speed diamond cutting machine, which equips with the advanced digital micrometer and digital speed display controller, it is the perfect tool for cutting/dicing/slicing all kinds of materials up to 32.5 mm thickness, especially for brittle crystals, ceramics, TEM samples, and even plastic samples. Also this cutting machine can be used for cutting cylindrical cell for failure analysis.
Model No. | CY-DS-100 |
Working oltage | AC 110V/220V switchable for worldwide usage |
Speed range | 0~600rpm with LED Digital display |
Cutting width & Depth | The cutting width of the slice is controllable from 1mm ~ 24mm by adjusting the LCD digital micrometer. The LCD micrometer is waterproof with a resolution of 0.001 mm and accuracy of +/-0.003 mm. |
Diamond blades | Three blades are included for cutting various materials |
Sample Holder & Mini-vise | Two angles adjustable sample holder is included, please click picture below for the details (max. opening 26mm) |
Package Dimensions | 19"(L) x 15"(W) x 15"(H) |
Shipping Weight & Dimension | 32 lbs, 18" x 14" x 14" |
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